PRODUCTION CAPABILITY
Flexible Printed Circuit
Rigid-Flex Board
Substrate-like PCB
Flexible Printed Circuit
Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film. FPC is favored for its light weight, thin thickness, and flexibility to bend and fold. It is widely used in automotive, medical, industrial control, communication, wearable, consumer electronics and other fields.
【ZECHENG ProductionCapacity】
Single, double, multi-layer FPC (up to 8 layers);
Our production process is divided into Panel to Panel and Roll to Roll, which is allowed us to provide solutions for small, medium and large volume to meet customers’ need;
Metallized hole filling & resin hole filling process;
Minimum aperture: 0.035mm;
Minimum line width/spacing: 0.035mm/0.035mm;
Any-layer blind and buried vias;
Impedance control;
Finished copper thickness: 1/3 ounce to 8 ounces (12um~280um);
Rigid-Flex Board
Rigid-Flex Board is a circuit board made of a combination of rigid and flexible board. The rigid area can be assembled with components, and the flexible area can be bent and connected to reduce the trouble of joints and the volume requirements of densely assembled products, while increasing the reliability of interconnection.
【ZECHENG ProductionCapacity】
Rigid-Flex Board (up to 10 layers)；
Improve the performance of bending area by glue dispensing；
The highest aspect ratio: 10:1；
Various types of Rigid-Flex board provided, including conventional, L2 HDI, asymmetric structure, flexible area differentiation etc；
Metallized hole filling & resin hole filling process；
Impedance control；
Finished copper thickness: 1/3 ounce to 2 ounces (12um~70um)；
Substrate-like PCB
Substrate-like PCB (SLP) is the next generation circuit board, which can shorten the line width/spacing from HDI's 40/40 microns to 30/30 microns. Our Modified Semi-Additive Process (mSAP) is based on how to overcome the problems of subtractive and additive methods in the production of fine line circuits. The mSAP process performs chemical copper on the substrate and forms a resist pattern on it. The pattern on the substrate is thickened by a sputtering process to remove the resist pattern, and then the excess chemical copper layer is removed by flash etching. The area of the film protection that is not thickened by electroplating is quickly removed during the differential etching process, and the remaining part forms a circuit.
【ZECHENG ProductionCapacity】
SLP Board (up to 20 layers);
Minimum line width/spacing: 0.025mm/0.025mm;
Minimum aperture: 0.020mm;
Die attach bond pitch: 0.12-0.18mm;
LCP material;
At R&D and sample stage currently, mass production is planned for 2022;
smt
backend
Assembly and test
| Process | Items | Process capability of Mass production |
| Solder paste Printing | Maximum PCB size | 450*370mm |
| Maximum weight of panel | 3kg | |
| Actual printing accuracy | 25μm >2.0CPK | |
| System calibration repeat accuracy | ±15μm >2.0CPK | |
| Pressure detection of squeegee | loop control system | |
| SPI | Minimum detectable spacing of solder balls | 100μm |
| X-Y axis accuracy | 1μm | |
| Error detection rate | ≤0.1% | |
| Pick and place | Range of component sizes | Laser 01005~-33.5mm / Camera 50x150m |
| Maximum component height | 25mm | |
| Maximum component weight | 50g | |
| Minimum BGA/CSP ball‘s spacing and diameter | 0.25mm，0.10mm | |
| Accuracy of pick and place | ±50um ±0.05° | |
| Range of panel sizes | 50*50mm—950*370 mm | |
| Range of the boards thickness | 0.3-4mm | |
| Maximum weight of panel | 3kg | |
| Maximum types of materials | 240 | |
| AOI | Smallest component | 01005 |
| Defect types | Wrong material,Component missing,Reversed,Misaligned, Tombstone,Billboard,Unsolder,Solder short,Overturned | |
| Detection of solder joint lift | 2D | |
| Reflow | Accuracy of temperature | ±1℃ |
| Soldering protection | Nitrogen protection(Amount of Residual oxygen＜1000ppm） | |
| Nitrogen control | Nitrogen closed-loop automatic control system, ±500ppm |
| Process | Items |
| Preprocess | Automatic Forming Technology of components | Automatic forming of components |
| De-panel | De-panel type | Punching and die cutting (FPC /PCB), Laser cutting (FPC), CNC Routing (PCB) |
| Accuracy | Die cutting :WEDM-LS(Wire cut Electrical Discharge Machining-Low Speed)±0.02mm, WEDM-HS(Wire cut Electrical Discharge Machining-High Speed)±0.05mm | |
| Laser cutting: ±0.02mm | ||
| Routing：±0.05mm | ||
| Maximum size of panel | Die cutting :500*350mm | |
| Laser cutting: 350*500mm | ||
| Routing：350*320mm | ||
| DIP | DIP technology | Manual |
| Wave-Soldering | Wave soldering | Selective wave soldering |
| Inclination angle of transport guide rail | 0° | |
| Temperature accuracy of General wave soldering | ±3℃ | |
| Steady accuracy of Selecting wave soldering | ±0.1mm | |
| Soldering protection | Nitrogen protection | |
| Coating technology | Maximum Panel size | 450*400*8mm |
| Maximum weight of single board | 25mm | |
| Minimum nozzle diameter | The minimum nozzle diameter is 0.7mm, selected according to the product. | |
| Other characters | Double-head spraying, spraying path, residence time, etc. can be controlled by the program. The technology can identify the front and back of the board and has the Fool-proofing function. | |
| Hot-Bar | Pitch | Minimum clearance: 0.2mm |
| Materials | ACF (Anisotropic Conductive Film) and solder paste | |
| Peeling strength | According to the product soldering pad size and materials to determine | |
| ICT | Test levels | Component level testing.Test the connection status of the hardware. |
| Number of test points | The standard number of test points is 320 and the maximum number is 4096 | |
| Test contents | Contact test, Open-Short test, Resistance and capacitance test, Second and third level FET(Field Effect Transistor) test, No-power mixed test, Boundary scan chain test, Power-on mixed mode test | |
| Water wash | Maximum width of panel | 450mm |
| Maximum height of panel | 100mm | |
| Equipment function | Single\Double Hurricane Jet, S-type nozzle, Electric air knife , Temperature, Time control |
| Process | Items |
| Product series | Automobile products | Automobile Electric Power Steering 、Automobile camera system components、 Automobile interior light components. |
| Consumer Electronics | Fingerprint module、Headphone/Speaker module、Touch module. | |
| Medical products | Spirometer、Blood glucose detector、Eye treatment device、Oximeter. | |
| FT(Functional Test) | Test level | Acoustic audio test , Network microwave measurement, Test in magnetic field |
| Temperature cycle test | Temperature range | Temperature -60-150℃ |
| Temperature rise and fall rate | ＞10℃/min | |
| Temperature deviation | Temperature ±2℃ | |
| Other reliability analysis tests | Aging test, Drop test, Vibration test, Salt spray test, Ion pollution test, Button life test |